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JCET Group

Provide EAP, RMS, etc. for packaging and testing plants

Customer Profile
JCET Group stands as the world’s premier integrated-circuit manufacturing and technology services provider, delivering a comprehensive suite of solutions encompassing semiconductor package integration design and characterization, wafer probe, package assembly, etc.
Systems Implemented
EAPRMS
Achieving Goals
Fully automated production
By introducing EAP and RMS, multiple production lines are transformed from manual to fully automated, eliminating human errors and inefficiencies.
System integration
Seamless integration of EAP and AGV systems for possible “light-off” operations.
Product & Services Industry Cases About Us
Contact Us
Market Promotion: +65 66941501
Business Inquiry: marketing@semi-tech.com
Postal Code: 627606
Headquarter: 3 Soon Lee Street，#03-20 Pioneer Junction，Singapore 627606
Subsidiaries
Malaysia: 86-G, Persiaran Bayan Indan, Bayan Bay, Bayan Lepas 11900 Penang, Malaysia
China: 10/F, T1 Building, 500 Xinlong Road, Minhang District, Shanghai, China
Japan: Tokyo PORT CITY Takeshiba 10F, Minato-ku 1-7-1, Tokyo 105-7510, Japan

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